TEC Peltier Thermoelectric Modules Best Cooling CH 044 18 08 Flash
Thermoelectrics in Space Applications
–Simplicity, reliability, compactness, low mass, noiseless,
–No moving parts
–Low efficiency, particularly with large temperature differences
•Best suited to situation with modest heat loads, cold temperatures
not below 150K, hot-to-cold side difference not exceeding 100K.
•A major TEC issue is the structural integrity of bismuth telluride
and soldered joints when subjected differential expansion stresses.
•Another potential issue is redundancy, which can lead to increased
complexity, larger heat loads, and greater radiator area.
–Infrared sensors, blackbody references, charge coupled devices,
high power integrated circuits, quartz crystal microbalances