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Adcol Electronics (Guangzhou) Co., Ltd.
Adcol Electronic (Guangzhou) Co., Ltd.
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Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

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Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

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Brand Name : Adcol

Model Number : A-gapfill 280

Certification : ISO9001, CE

Place of Origin : China

MOQ : 10

Price : Negotiation

Payment Terms : T/T , Paypal

Supply Ability : 100kpcs per month

Delivery Time : 3 - 4 weeks

Packaging Details : Solid carton packaging

Color : Light gray

Thickness : 0.08" (2.032mm)

Thickness Tolerance : ±0.008" (±0.20mm)

Density : 1.73 g / cbm

Hardness : 45 Shore A

Tensile Strength : 48 psi

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Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density


​A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not requiring additional adhesive coating, the
​A-gapfill 200 can inhibit thermal performance. This gap filler is both electrically insulating and stable from -40°C to 160°C and meets UL 94 VO rating.

FEATURES
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)

APPLICATIONS
• Cooling components to the chassis or frame
• High speed mass storage drives
• RDRAM memory modules
• Heat pipe thermal solutions
• Automotive engine control units
• Wireless communication hardware

  A-gapfill 280
Construction & Composition Ceramic filled
silicone elastomer
Color Light Gray
Thickness 0.08" (2.032mm)
Thickness Tolerance
± 0.008" (± 0.20mm)
Density 1.73 g/cm3
Hardness 45 Shore 00
Tensile Strength 48 psi
% Elongation 60.6
Outgassing TML
(post cured)
0.34%
Outgassing CVCM
(post cured)
0.10%
UL Flammability Rating 94 VO
Temperature Range -45°C to 160°C
Thermal Conductivity 1.1 W/mK
Total Thermal resistance @ 100 psi @69KPa 2.51 °C-in2/W
16.19 °C-cm2/W
Coefficient of Thermal Expansion 229 ppm/°C
35°C to 130°C
Breakdown voltage >27,000 Volts
Volume resistivity 4 x 1013 ohm-cm
Dielectric constant @ 1MHz 5.5

STANDARD THICKNESS
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory for alternate thicknesses

STANDARD SHEET SIZE
9" x 9" (229mm x 229mm) A-gapfill 200 may be die cut into individual shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.

REINFORCEMENT
0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.
Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density


Product Tags:

thermal conductive material

      

thermal interface material

      
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